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Brand Name : FOTMA
Model Number : Cu/MoCu/Cu
Certification : ISO9001:2008
Place of Origin : P.R. China
MOQ : 1 pcs
Price : Negotiable
Payment Terms : T/T, L/C, Western Union, PayPal
Supply Ability : 10000pcs/month
Delivery Time : 20-25 days after deposit
Packaging Details : Paper cartons or plywood boxes
Cu/MoCu/Cu (CPC) Heat Sink
Heat Sink Description:
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
Heat Sink Product Properties:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
Heat Sink Application:
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.
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Cu/MoCu/Cu (CPC) Heat Sink Electronic Packaging Materials Images |