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Cu/MoCu/Cu (CPC) Heat Sink Electronic Packaging Materials

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Cu/MoCu/Cu (CPC) Heat Sink Electronic Packaging Materials

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Brand Name : FOTMA

Model Number : Cu/MoCu/Cu

Certification : ISO9001:2008

Place of Origin : P.R. China

MOQ : 1 pcs

Price : Negotiable

Payment Terms : T/T, L/C, Western Union, PayPal

Supply Ability : 10000pcs/month

Delivery Time : 20-25 days after deposit

Packaging Details : Paper cartons or plywood boxes

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Cu/MoCu/Cu (CPC) Heat Sink

Heat Sink Description:

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Heat Sink Product Properties:

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CPC141 9.5 7.3 280(XY)/170(Z)

Heat Sink Application:

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.


Cu/MoCu/Cu (CPC) Heat Sink Electronic Packaging Materials


Product Tags:

Cu CPC Heat Sink

      

MoCu Heat Sink

      

Electronic Packaging Heat Sink

      
Wholesale Cu/MoCu/Cu (CPC) Heat Sink Electronic Packaging Materials from china suppliers

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